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Low Tech:

  • Material: CEM-1, CEM-3, FR-1, FR-2, FR-4
  • Hole drilling, Hard Tooling / Punch
  • Min Hole, punch .035"
  • Min Hole, drill .018"
  • Hole Location Tolerance +/- .00311 of TP
  • Min Line Width & Space .020" /.020"
  • Min SMD Pitch .020"
  • Thickness: .031 " to .093"
  • Carbon Ink
  • Peelable Mask & Inks
  • HASL/Lead Free Solder/OSP/Immersion: Gold/Tin/Silver
  • LPI & UV Solder Mask
  • Tab: Hard Gold
  • CNC V-Scoring
  • 100% Electrical Test for Opens and Shorts
  • Flying Probe
  • Board Flatness Tolerance: 7%
High Tech:

  • Materials FR-1,2,3 ,Cem-1 and Cem-3
  • Solder mask LPI and UVElectrical Test opens,shorts
  • Minimum Line and space .007/.007
  • Hole minimum size .017
  • Hole location tolerance .005
  • Punch and Punch push back
  • 2 -16 layer
  • Aluminum Core/Arlon/Teflon/FR4/Getek/Rogers/Theragon
  • Flex, Flex Rigid (Including Multilayer)
  • Blind / Buried Via Capability
  • Min Line Width & Space .004" /.004"
  • Min Hole Size .008"
  • Hole Location Tolerance +/-.003
  • .004" Min Dielectric
  • .018" to .196" Thk
  • LPI Solder Masks
  • HASL/OSP/Immersion: Gold/Tin/Silver/Lead Free Solder/Palladium
  • Tab: Hard Gold
  • Carbon Ink
  • Peelable Mask & Inks
  • Silver and Epoxy Filled Vias
  • CNC V-Scoring
  • 100% Electrical Test, Opens and Shorts, & Impedance Control
  • Flying Probe
  • Automatic Hole Counting Equipment
  • Quick Turn Capability Quick Turn Capability
  • Quick Turn Capability

Advance Technologies Available


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